Sustainable Industry 6.0 Manufacturing: Integrating Nanotechnology, Quantum Intelligence, and Autonomous Production Systems
DOI:
https://doi.org/10.15377/2409-5818.2025.12.7Keywords:
Industry 6.0 manufacturing, Autonomous and smart factories, Quantum intelligent manufacturing, Sustainable manufacturing systems, Nanotechnology-enabled production.Abstract
The shift from Industry 5.0 to Industry 6.0 marks a significant change in manufacturing, with control transitioning from workflows to the materials themselves involved, while autonomous systems manage production at nanometer and quantum levels. Sustainable nanotechnology is at the heart of this evolution, combining environmental performance, process efficiency, and material precision as key governance factors. This chapter outlines a detailed framework for integrating sustainability into manufacturing choices, showing that environmental performance can shift from being an afterthought to a key factor in operational control. The discussion outlines mechanisms ranging from atomic-scale materials to fleet-level autonomy, positioning Industry 6.0 as a robust, energy-efficient, and scalable framework for future production systems.
References
[1] Duggal AS, Malik PK, Gehlot A, Singh R, Gaba GS, Masud M, et al. A sequential roadmap to Industry 6.0: exploring future manufacturing trends. IET Commun. 2022; 16: 521-31. https://doi.org/10.1049/cmu2.12284
[2] Reddy CKK, Doss S, Pamulaparty L, Lippert K, Doshi R. Industry 6.0: technology, practices, challenges, and applications. 1st ed. Boca Raton: CRC Press; 2024.https://doi.org/10.1201/9781003517993
[3] Schrödinger E. Quantum mechanics 100 years on: an unfinished revolution. Nature 2025; 637: 251-2. https://doi.org/10.1038/d41586-025-00014-5
[4] Elzein B. Nano revolution: tiny tech, big impact: how nanotechnology is driving SDGs progress. Heliyon. 2024; 10: e31393. https://doi.org/10.1016/j.heliyon.2024.e31393
[5] Sharma S. Quantum-nano synergies: business potential and disruptions. Nanoscale Rep. 2019; 2: 41-4. https://doi.org/10.26524/nr1942
[6] Kumar U, Kumar R, Singh M, Singh M, Singh H, Singh R, et al. A critical review on history of industrial revolutions. AIP Conf Proc. 2025; 3185: 020097. https://doi.org/10.1063/5.0240534
[7] Center for Quantum Nanoscience. What is Quantum Nanoscience? Available from: https://qns.science/what-is-quantum-nanoscience/ (accessed 4 Sep 2025).
[8] Matityahu S, Shnirman A, Schön G, Schechter M. Decoherence of a quantum two-level system by spectral diffusion. Phys Rev B. 2016; 93: 134208. https://doi.org/10.1103/PhysRevB.93.134208
[9] López-Núñez D, Torras-Coloma A, Portell-Montserrat Q, Bertoldo E, Cozzolino L, Ummarino GA, et al. Superconducting penetration depth of aluminum thin films. Supercond Sci Technol. 2025; 38: 095004. https://doi.org/10.1088/1361-6668/adf360
[10] Devade K, Singh PK, Kumar S, Kumar H, Prasad B, Rao ALN, et al. Green nanotechnology based sustainable energy solutions and environmental impacts. In: E3S Web Conf. Vol 511. Gurugram, India: EDP Sciences; 2024. p. 01031. https://doi.org/10.1051/e3sconf/202451101031
[11] Malik S, Muhammad K, Waheed Y. Nanotechnology: a revolution in modern industry. Molecules. 2023; 28: 661. https://doi.org/10.3390/molecules28020661
[12] Kjaergaard M, Schwartz ME, Braumüller J, Krantz P, Wang JI-J, Gustavsson S, et al. Superconducting qubits: current state of play. Annu Rev Condens Matter Phys. 2020; 11: 369-95. https://doi.org/10.1146/annurev-conmatphys-031119-050605
[13] Putterman H, Noh K, Hann CT, MacCabe GS, Aghaeimeibodi S, Patel RN, et al. Hardware-efficient quantum error correction via concatenated bosonic qubits. Nature. 2025; 638: 927-34. https://doi.org/10.1038/s41586-025-08642-7
[14] Mullen E, Morris MA. Green nanofabrication opportunities in the semiconductor industry: a life cycle perspective. Nanomaterials. 2021; 11: 1085. https://doi.org/10.3390/nano11051085
[15] Gao J, Luo X, Fang F, Sun J. Fundamentals of atomic and close-to-atomic scale manufacturing: a review. Int J Extrem Manuf. 2021; 4: 012001. https://doi.org/10.1088/2631-7990/ac3bb2
[16] Tarasov MA, Chekushkin AM, Fominsky MYu, Zaharov DM, Lomov AA, Devitsky OV, et al. Superconducting thin films and tunnel junctions based on aluminum. Phys Solid State. 2022; 64: 1352. https://doi.org/10.21883/PSS.2022.10.54217.35HH
[17] Yang Z, Liu S, Li L, Chen Q, Shi C, Dong L, et al. From nano robotic manipulation to nano manipulation robot. SmartBot. 2025; : 1(3): e12021. https://doi.org/10.1002/smb2.12021
[18] Chen S, Yu VW, Jin Y, Govoni M, Galli G. Advances in quantum defect embedding theory. J Chem Theory Comput. 2025; 21: 7797-812. https://doi.org/10.1021/acs.jctc.5c00559
[19] Shadi MR, Mirshekali H, Shaker HR. Explainable artificial intelligence for energy systems maintenance: a review on concepts, current techniques, challenges, and prospects. Renew Sustain Energy Rev. 2025; 216: 115668. https://doi.org/10.1016/j.rser.2025.115668
[20] Van Damme J, Massar S, Acharya R, Ivanov T, Perez Lozano D, Canvel Y, et al. Advanced CMOS manufacturing of superconducting qubits on 300 mm wafers. Nature. 2024; 634: 74-9. https://doi.org/10.1038/s41586-024-07941-9
[21] Thulasi M, Faieza AA, Azfanizam AS, Leman Z. State of the art of dynamic value stream mapping in the manufacturing industry. JMMST. 2022; 6: 41-52. https://doi.org/10.15282/jmmst.v6i1.7376
[22] Liu I-Y, Winckel LV, Boakes L, Bardon MG, Rolin C, Ragnarsson L-Å. Modeling the energy consumption of integrated circuit fab infrastructure. IEEE Trans Semicond Manuf. 2024; 37: 422-7. https://doi.org/10.1109/TSM.2024.3408926
[23] Burkard G, Ladd TD, Pan A, Nichol JM, Petta JR. Semiconductor spin qubits. Rev Mod Phys. 2023; 95: 025003. https://doi.org/10.1103/RevModPhys.95.025003
[24] Ohba T, Sakui K, Sugatani S, Ryoson H, Chujo N. Review of bumpless build cube (BBCube) using wafer-on-wafer and chip-on-wafer for tera-scale three-dimensional integration. Electronics. 2022; 11: 236. https://doi.org/10.3390/electronics11020236
[25] Schmelz M, Mutsenik E, Bravin S, Sultanov A, Ziegler M, Hübner U, et al. Wafer-scale Al junction technology for superconducting quantum circuits. IEEE Trans Appl Supercond. 2024; 34: 1-5. https://doi.org/10.1109/TASC.2024.3350580
[26] Bar-Gill N, Pham LM, Jarmola A, Budker D, Walsworth RL. Solid-state electronic spin coherence time approaching one second. Nat Commun. 2013; 4: 1743. https://doi.org/10.1038/ncomms2771
[27] You Y, Chen C, Hu F, Liu Y, Ji Z. Advances of digital twins for predictive maintenance. Procedia Comput Sci. 2022; 200: 1471–80. https://doi.org/10.1016/j.procs.2022.01.348
[28] Abdurakhimov LV, Mahboob I, Toida H, Kakuyanagi K, Matsuzaki Y, Saito S. Identification of different types of high-frequency defects in superconducting qubits. PRX Quantum. 2022; 3: 040332. https://doi.org/10.1103/PRXQuantum.3.040332
[29] Arnold G, Werner T, Sahu R, Kapoor LN, Qiu L, Fink JM. All-optical superconducting qubit readout. Nat Phys. 2025; 21: 393-400. https://doi.org/10.1038/s41567-024-02741-4
[30] Dong Z, Lin Y. Ultra-thin wafer technology and applications: a review. Mater Sci Semicond Process. 2020; 105: 104681. https://doi.org/10.1016/j.mssp.2019.104681
[31] Vijay AJ, William BNJ, Haruna AA, Prasad DD. Exploring the synergy of IIoT, AI, and data analytics in Industry 6.0. In: Reddy CKK, Doss S, Pamulaparty L, Lippert K, Doshi R, Eds. Industry 6.0: technology, practices, challenges, and applications. 1st ed. Boca Raton: CRC Press; 2024, p. 36.
[32] Iliuţă M-E, Moisescu M-A, Pop E, Ionita A-D, Caramihai S-I, Mitulescu T-C. Digital twin: a review of the evolution from concept to technology and its analytical perspectives on applications in various fields. Appl Sci. 2024; 14: 5454. https://doi.org/10.3390/app14135454
[33] Hess P. Thickness of elemental and binary single atomic monolayers. Nanoscale Horiz. 2020; 5: 385-99. https://doi.org/10.1039/C9NH00658C
[34] Kantaros A, Ganetsos T, Pallis E, Papoutsidakis M. From mathematical modeling and simulation to digital twins: bridging theory and digital realities in industry and emerging technologies. Appl Sci. 2025; 15: 9213. https://doi.org/10.3390/app15169213
[35] Mathew PT, Rodriguez BJ, Fang F. Atomic and close-to-atomic scale manufacturing: a review on atomic layer removal methods using atomic force microscopy. Nanomanuf Metrol. 2020; 3: 167-86. https://doi.org/10.1007/s41871-020-00067-2
[36] Garg R, Gonuguntla S, Sk S, Iqbal MS, Dada AO, Pal U, et al. Sputtering thin films: materials, applications, challenges and future directions. Adv Colloid Interface Sci. 2024; 330: 103203. https://doi.org/10.1016/j.cis.2024.103203
[37] Ingemarsdotter E, Kambanou ML, Jamsin E, Sakao T, Balkenende R. Challenges and solutions in condition-based maintenance implementation: a multiple case study. J Clean Prod. 2021; 296: 126420. https://doi.org/10.1016/j.jclepro.2021.126420
[38] Caro-Ruiz C, Lombardi P, Richter M, Pelzer A, Komarnicki P, Pavas A, et al. Coordination of optimal sizing of energy storage systems and production buffer stocks in a net zero energy factory. Appl Energy. 2019; 238: 851-62. https://doi.org/10.1016/j.apenergy.2019.01.125
[39] Sovacool BK, Geels FW, Iskandarova M. Industrial clusters for deep decarbonization. Science. 2022; 378: 601-4. https://doi.org/10.1126/science.add0402
[40] Liu F, Christou A, Dahiya AS, Dahiya R. From printed devices to vertically stacked, 3D flexible hybrid systems. Adv Mater. 2025; 37: 2411151. https://doi.org/10.1002/adma.202411151
[41] Koenig F, Carwehl M, Imrie C. ResMetric: analyzing resilience to enable research on antifragility. In: 2025 IEEE/ACM 20th Symposium on Software Engineering for Adaptive and Self-Managing Systems (SEAMS). 2025. p. 32-8. https://doi.org/10.1109/SEAMS66627.2025.00012
[42] Trujillo-Sevilla JM, Roqué-Velasco A, Sicilia MJ, Casanova-González Ó, Ramos-Rodríguez JM, Gaudestad J. Wafer geometry technique for blank 300 mm silicon wafers. In: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). 2022. p. 1-7. https://doi.org/10.1109/ASMC54647.2022.9792490
[43] Kim T, Lee J. Fabrication and characterization of silicon-on-insulator wafers. Micro Nano Syst Lett. 2023; 11: 15. https://doi.org/10.1186/s40486-023-00181-y
[44] Naeij HR. Open quantum system approaches to superconducting qubits. Quantum Inf Process. 2025; 24: 220. https://doi.org/10.1007/s11128-025-04838-y
[45] Hu Q, Guo Y, Cordy M, Xie X, Ma L, Papadakis M, et al. An empirical study on data distribution-aware test selection for deep learning enhancement. ACM Trans Softw Eng Methodol. 2022; 31: 78:1-30. https://doi.org/10.1145/3511598
[46] Osman A, Fernández-Pendás J, Warren C, Kosen S, Scigliuzzo M, Frisk Kockum A, et al. Mitigation of frequency collisions in superconducting quantum processors. Phys Rev Res. 2023; 5: 043001. https://doi.org/10.1103/PhysRevResearch.5.043001
[47] Cao H. Refrigeration below 1 kelvin. J Low Temp Phys. 2021; 204: 175-205. https://doi.org/10.1007/s10909-021-02606-7
[48] Bartee SK, Gilbert W, Zuo K, Das K, Tanttu T, Yang CH, et al. Spin-qubit control with a milli-kelvin CMOS chip. Nature. 2025; 643: 382-7. https://doi.org/10.1038/s41586-025-09157-x
[49] Zhang Q, Zhang Y, Luo Y, Yin H. New structure transistors for advanced technology node CMOS ICs. Natl Sci Rev. 2024; 11: nwae008. https://doi.org/10.1093/nsr/nwae008
[50] Fan YY. Demand prediction of production materials and simulation of production management. Int J Simul Model. 2022; 21: 720-31. https://doi.org/10.2507/IJSIMM21-4-CO20
[51] Neyens S, Zietz OK, Watson TF, Luthi F, Nethwewala A, George HC, et al. Probing single electrons across 300-mm spin qubit wafers. Nature. 2024; 629: 80-5. https://doi.org/10.1038/s41586-024-07275-6
[52] Nagapurkar P, Das S. Economic and embodied energy analysis of integrated circuit manufacturing processes. Sustain Comput Inform Syst. 2022; 35: 100771. https://doi.org/10.1016/j.suscom.2022.100771
[53] Meshalkin VP, Stoyanova OV, Dli MI. Project management in the nanotechnology industry: specifics and possibilities of taking them into account. Theor Found Chem Eng. 2012; 46: 50-4. https://doi.org/10.1134/S0040579512010101
[54] Zhu J, Liu X, Wang Q, Li Y, Wu Q, Li Y. A study of the via pattern lithography process window under the 7 nm logic design rules with 193 nm immersion lithography. In: China Semiconductor Technology International Conference (CSTIC). Shanghai: IEEE; 2024. p. 1–3. https://doi.org/10.1109/CSTIC61820.2024.10531838
[55] Huang X, Auffan M, Eckelman MJ, Elimelech M, Kim J-H, Rose J, et al. Trends, risks and opportunities in environmental nanotechnology. Nat Rev Earth Environ. 2024; 5: 572-87. https://doi.org/10.1038/s43017-024-00567-5
[56] Dhingra R, Naidu S, Upreti G, Sawhney R. Sustainable nanotechnology: through green methods and life-cycle thinking. Sustainability. 2010; 2: 3323-38. https://doi.org/10.3390/su2103323
[57] Shim W, Natelson D, Arbiol J, Besley E, Dionne JA, Herrmann C, et al. The next 25 years of nanoscience and nanotechnology: a Nano Letters roadmap. Nano Lett. 2025; 25: 12789-98. https://doi.org/10.1021/acs.nanolett.5c04115
Downloads
Published
Issue
Section
License
Copyright (c) 2025 Dinesh K. Madheswaran, Ram Krishna, Suresh Gopi
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
All the published articles are licensed under the terms of the Creative Commons Attribution Non-Commercial License (CC BY-NC 4.0) which permits unrestricted, non-commercial use, distribution and reproduction in any medium, provided the work is properly cited.
